Novoblade™ G1
Novoblade Backplane G1
Product Code
Capacity
Up to 20 Novoblade modules for 11.52PB total capacity (Expandable).
Form Factor
2U 19”. Rack Mount. Integrated DC PSU. 1000mm depth. Rail kit available
2U 19”. Rack Mount. Integrated AC PSU. 1200mm depth. Rail kit available
2U 21”. Rack Mount. ORv3 busbar PSU. 1000mm depth
Power
Idle: <400W, Average: 1300W, Max: 2600W.
Power Supply
2600W ±48V Isolated DC Hot-Swappable N+1 PSU.
2600W 110-240V AC Hot-Swappable N+1 PSU.
208-528V AC. 3 Phase, 3 Wire + PE. 2U Industrial Power Shelf. N+1 Redundant. PMBus support.
Each unit powers multiple 48V DC Novoblade enclosures using either busbars or leads. (note: total output will vary by installation and requires certification by a qualified technician)
Networking and other Features
4x Hot-Swappable Novofabric modules with Dual QSFP56-DD and Dual 1GbE.
QSFP56-DD uplinks can be independently configured for Ethernet, InfiniBand or CXL 3.1.
(note: the backplane partitions Novoblades into groups of 10 for 1+1 redundancy)
Novoblade Module G1
Product Code
Adaptive SoC
AMD Versal AI Edge G2 (2VE3558)
Operating Systems
Red Hat Enterprise Linux, Ubuntu LTS, SUSE Linux Enterprise
Data Platforms
Ceph, MinIO, DAOS (Planned)
CPU
8x ARM64 Cortex-A78AE Cores @ 1.8-2.2GHz
RAM
96GB DDR5 w/ ECC @ 5600 MT/s
Networking
Ethernet – 2x 10/25/50GbE. RoCEv2 RDMA (planned). IEEE 802.1 TSN.
Infiniband – Supported via RoCEv2 bridging in Novofabric backplane modules. (planned)
CXL – 2x CXL 3.1 in host or device mode @ PCIe Gen5x2 speeds. (seeking customer feedback)
Video Codecs
AI/ML Compute (Optional)
96 AIE-MLv2 Tiles, 123 TOPS (INT8 Dense), 246 TOPS (INT8 Sparse)
FPGA Compute Resources
225K LUTs, 700 DSP Engines (note: the base system requires FPGA resources)
Storage
128GB UFS (Soldered), up to 4x Novodisq 144TB E2 SSDs for 576TB total capacity (Expandable).
Device Security
TPM2, Secure Boot, Full Memory Encryption and Full Disk Encryption
Power
Idle: <10W, Average: 40W, Max: 60W
Novoblade 144TB E2 SSD Drive
Product Code
DISQ-144-E2-G1
Capacity
144,000 GB (1GB = 1 Billion Bytes). Actual capacity may be less due to formatting and operating system overheads.
Connectivity
EDSFF PCIe Gen4x4. SMBus. SR-IOV support (planned).
Interface
NVMe 2.1 w/ NVM and Zoned Command Set support. TCG Opal SSC (planned).
NVMe Management Interface (planned).
Optional/Vendor-Specific NVMe Features
OCP Datacentre NVMe Specification (planned). <100us Interrupt Coalescing.
WORM namespace support (planned). Tang NBDE KEK Exchange (planned).
Form Factor
Data Retention
Operational: 10 Years @ 55°C, Non-Operational: 3 Months @ 40°C
Data Resilience
End-to-end checksuming. Background media scans. Advanced LDPC ECC.
Data Integrity (planned)
AES-XTS-256 (NIST SP 800-38E). HMAC-SHA3-512 (FIPS 198-1 & FIPS 202).
High-endurance monotonic counters. End-to-end cryptographic checksumming.
NAND Properties
3D TLC NAND. 16 KiB Relocation Unit. Mixed TLC/SLC modes available.
Performance Target
8-10 MB/s per TB
Write Endurance
701,000,000 GB
Throughput (Read/Write)
Up to 1000MB/s
QD1/4K IOPS (Read/Write)
Up to 70K/30K IOps
Power
Average: 5W, Max: 10W. Max power can be configured by end users.
Power-Loss Protection
Firmware PLP.
Device Integrity
PQC Secure Boot. Firmware Measurement & Digest. Firmware Rollback Protection.
128-bit Unique Serial Number. Integrated Security IC, RTC and TRNG.